New software - Version 3.36

[Dataman (Daniel Smith)]

Dear Dataman users,

New software has just been posted on our software pages for the Dataman 48Pro2AP super fast industrial universal programmer.

Version 3.36 features the following amendments:

New Device Support
Many new devices have been added in this revision, please download the full device list to verify your chip is supported: Dataman48Pro2APDeviceList.pdf

Major Changes
Fixed in PG4UWMC: Automatic YES! settings changed by General options dialog are now correctly passed to all programmer Sites
Fixed in PG4UWMC: command "Refind Programmer Site" is now working only, when programmer Site is already connected (to prevent hazard with same serial number values used for more Sites)
Improved displaying of information about found Credit Boxes
PG4UWMC: "LED color scheme" bug fixed, caused inversion of result LED colors

Other Changes
Added module: AP1 BGA64-2.1 ZIF NOR-8
Added module: AP1 QFN40 ZIF SiM-1
Added module: AP1 QFN56-2.02 ZIF CC-1
Added module: AP1 QFN64 ZIF SiM-1
Added module: AP1 QFP100-1.02 ZIF R5F-7
Added module: AP1 QFP32-1.04 ZIF R5F-1
Added module: AP1 SSOP20-155 ZIF ET-1
Adesto Techn. AT25DF081, power-up sequence modified
Adesto Techn. AT25DL081, AT25DL081 (Dual I/O), power-up sequence modified
Altera EPCQ, adding of information about a POF file compatibility created in PG4UW
Atmel AT25DF081, power-up sequence modified
Atmel AT25DL081, AT25DL081 (Dual I/O), power-up sequence modified
Atmel ATmega644/1284/2564RFR2 [VQFN48], added support
Cypress CY8C4xxx, CYPD3xxx, CYPD4xxx, CYAT81xxx, programming speed increased
Cypress/Spansion HyperFlash S26KLxxxS, AutomaticYES improved
Cypress/Spansion S25FLxxxL, improving of Verify operation
Dosilicon FM25Q64A, improving of Verify operation
Fidelix FM25M32B, improving of Verify operation
Infineon XMC1404-xxxxx0200AA [LQFP64], Special options improved
Infineon/IR IR35201, IR35203, IR35204, improving of scan I2C address
Lattice ispLSI2064 [TQFP100], ID code check test improved
Lattice LCMXO3LF-9400C, ID check error if specific pgm content is programmed, resolved
Lattice LFX125B/C/EB/EC, LFX200B/C/EB/EC [fpBGA256], improving of pgm parameter assignment
Lattice MachXO2, MachXO3, power up sequence improved
Microchip PIC32MX470F512L (4wire JTAG), power-up procedure modified
Micron MT25Qxxx family, improving of Verify operation
Micron N25Qxxx family, improving of Verify operation
Micron/Numonyx/STMicroelectronics M29W128GLxxN [TSOP56], power-on/off and programming procedure modified
Nec/Renesas uPD70F3743, initialization procedure improved
Numonyx N25Qxxx family, improving of Verify operation
NXP/Freescale Semic. MC9S12G192/240, buffer data layout for logical (paged) default changed
NXP/Freescale Semic. MPC560xP, programming algorithm improved, reserved cflash test sector area removed
Renesas R5F72549RKBGV [BGA272] Boot mode, support modified
Renesas R7F701401, modified number of Lock bits
Renesas R7F701417, added OPBT0 bit
Sanken Electric SX68203M, added of Read procedure
STMicroelectronics SPC560Bxx, part number suffix explanation added to device info
STMicroelectronics STM32F0xxRxH [UFBGA64], STM32L072RxI [UFBGA64], STM32L4xxRxI [UFBGA64], support improved
STMicroelectronics STM32F2xxVxT [LQFP100], insertion test improved
TI (TMS) CC2544 [QFN32], programming procedure improved
TI (TMS) MSP430Fxxxx, power up procedure modified
Winbond W25Q128FWxxxQ [SOIC8] (QuadSPI), verify procedure improved

Bug Fixes
ABOV Semiconductor AC30M1364, erase bug fixed
GigaDevice Semic. GD25D10B [TSSOP8], AP1 module insertion test bug fixed
Infineon XMC1404-xxxxx0200AA [LQFP64], flash size bug fixed
Lattice ispLSI2032E [PLCC44], pin assignment parameters bug fixed
Lattice LCMXO3L-4300C [caBGA400], ID code parameters assignment bug fixed
Microchip dsPIC33FJxxxGPxxx in QFP100 package, insertion test bug fixed
Microchip PIC16F18324, ID check error bug fixed
Microchip PIC16F527 [UQFN20 4x4], package dimensions information fixed
Microchip PIC16F/LF1824/1828, setting of BORV bits bug fixed
Microchip PIC18FxxK40/42, description of XINST configuration bit fixed
Microchip PIC32MZ Family in 4wire JTAG mode, programming procedure bug fixed
Micron MT25QU256ABA8E [SO16W] (Quad I/O), "Manufacturer / device ID check error!" fixed
NXP/Freescale Semic. MC9S12XS128 [QFP80], communication error fixed
NXP/Freescale Semic. MWCT1012 [QFN32], programming bug fixed
NXP/Freescale Semic. S9S12XS128 [QFP80], BDM configuration fixed
Serial NAND flash devices in SOP16 package, Unexpected error 1 [IEC:2, D:3E]! fixed
TI (TMS) MSP430F532x, MSP430F551x, MSP430F552x in LQFP80 package, overcurrent bug fixed
Winbond W25Q128JVxxQ [SOIC8-200] (QuadSPI), verify bug fixed
Winbond W25Q40EW [USON8 2x3], Insertion test bug fixed

Best regards,

Daniel Smith