New software - Version 3.79
Posted: 21 Sep 2022 15:53
Dear Dataman users,
New software has just been posted on our software pages for the Dataman 448Pro2AP super fast industrial gang programmer.
Version 3.79 features the following amendments:
New Device Support
Many new devices have been added in this revision, please download the full device list to verify your chip is supported: Dataman448Pro2APDeviceList.pdf
Major Changes
General Options/Job Report, file name generation bug fixed
Improved identification of some BGA programming adapter
Menu/Help/Create problem report: processing fixed
Other Changes
Added module: AP1 BGA84-1 ZIF mXT-1
Added module: AP1 LGA86 ZIF STM32WB-1
Added module: AP1 QFN32-1.02 ZIF STM32G-1
Added module: AP1 QFN40-2.02 ZIF TPS53-5
Added module: AP1 QFN48-2.02 ZIF TPS53-2
Added module: AP1 QFN56-1.02 ZIF XDPE-1
Added module: AP1 QFN8-4.02 ZIF M88SDP-1
Added module: AP1 SOIC8 ZIF 150mil AVR-1
Adesto Techn. AT25FFxxx, AT25XExxx family, Chip erase verify improved
Adesto Techn. AT25XE family, Erase operation improved
Atmel/Microchip SPLD devices, adding of bypass capacitor information
Dallas/Maxim DS1820, DS18B20, DS18S20, DS1822, DS1825, DS2401, DS2430, DS2431, DS2432, DS2433, DS2436, DS2438, DS2756, DS2762, DS2781, DS2788, DS2406, DS2502, DS2505, DS2506, DS28E01, DS28E02, DS28E04, DS28E15, DS28EC20, DS2788 Family code check added
Dialog Semicond. AT25FFxxx, AT25XExxx family, Chip erase verify improved
Fudan Microelect. FM25F01B, FM25F005B, FM25Q02B, FM25W02, setting Protected memory modified
GigaDevice GD25Q20E, GD25LQ20B, GD25LQ20E, GD25VQ40C, GD25Q40E, GD25LQ16E, GD25LE16E, setting Protected memory modified
Infineon AURIX family, program/verify procedure and save HEX file procedure modified
Infineon TDA38640, programming improved
Infineon TDA38640 change name to TDA38640 rev. 2/3 [PQFN-5x6]
Infineon TDA38740 change name to TDA38740 rev. 2/3 [PQFN-5x6]
Intel/Numonyx J3 series, blank check procedure improved
Intel/Numonyx PC28F128J3F [Easy BGA64], read of Protection Register modified
Macronix MX25Lxx356, MX25Uxx356, state of Status Register modified during Chip erase
Microchip dsPIC33CK Family, erase before programming improved
Microchip dsPIC33CK64MP102, programming CFG improved
Microchip PIC12F629, PIC12F675, PWRT and BODEN bits description improved
Microchip PIC32MZ EF Family, ABF1SEQ0, ABF2SEQ0, SEQ0, BF1SEQ0, BF2SEQ0 registers removed and SEQ3, BF1SEQ3, BF2SEQ3 registers added
Microsemi ZL3026x, power-up procedure improved
Module AP1 SOIC8 ZIF 150mil AVR-1, automatic yes parameters modified
Motorola/Freescale Semic./NXP MC56F8xxx, DEBUG MODE entrance modified
MPS MP2971/73, programming procedure improved
MPS MP2975/8, conversion of .txt file to .bin file improved
NXP/Freescale Semic. MK10DX256xxx7 [LQFP100], insertion test modified
Nyquest Technology N25Q Series, read operations improved
Nyquest N25Q004A [SOP8-150] (QuadSPI), N25Q008A [SOP8-150] (QuadSPI), N25Q016B [SOP8-150] (QuadSPI), N25Q032A [SOP8-150] (QuadSPI), added support
Renesas R5F524TxAxFF [LQFP80], Boot mode erase modified
Renesas R5F564xxxxxx, programming modified
Renesas R5F564xxxxxx and R5F566xxxxxx, added selectable option 'Skip blank blocks during programming' for programming
Renesas R7FA2E1AxxxFL, programming process modified
Renesas/Intersil RAA228227, RAA228228 programming improved
Renesas/Intersil RAA229126 [QFN48-6x6] (Gen. 3 silicon), ISL69260 [QFN40-5x5] (Gen. 3 silicon), improved support for production silicon
Sandisk SDINBDxx-xxx devices, added option UNI_BOOT_PROC_ENABLE, PPP_FEATURES_ENABLE
Silicon Laborat. EFR32xG13 devices, improving of "Bootloader area" programming procedure
STMicroelectronics STM32G0xx, family option bytes modification
STMicroelectronics STM32H7xx, devices erase procedures modified
STMicroelectronics STM8S001J3M, erase procedures improved
TI (TMS) BQ2022, Family code check added
TI (TMS) BQ26100, ID check modified to family code check
TI (TMS) MSP430G2221, MSP430G2231 power-up procedure improved
TI (TMS) TMS320F28033, programming algorithm improved
Winbond W25N01KVZE [WSON8], device ID check updated according to new datasheet
XMC XM25QH20B, XM25QU20B, setting Protected memory modified
XTX XT25Q08D, setting Protected memory modified
Zbit ZB25VQ40, ZB25LQ40, ZB25VQ16, setting Protected memory modified
Zetta ZD25Q16, setting Protected memory modified
Bug Fixes
Atmel/Microchip ATmega8/L/A [MLF32], Overcurrent error bug fixed
Nuvoton NUC126SG4AE [LQFP64], ID check bug fixed
Nuvoton NUC126Sxxx, APROM size error fixed
Renesas/Intersil ISL69260 [QFN40-5x5] (Gen. 3 silicon), verification bug fixed
Renesas R5F10BGGCxFB [LQFP48], device ID check bug fixed
STMicroelectronics STM32H72x and STM32H73x, Erase Method setting fixed
TI (TMS) BQ26100, Manufacturer / device ID check error bug fixed
Winbond W25Nxxxxxx, Dosilicon DS35xxxB, Macronix MX35UFxG24AD, permanent block lock treatment fixed (default value fixed)
Best regards,
Daniel Smith
New software has just been posted on our software pages for the Dataman 448Pro2AP super fast industrial gang programmer.
Version 3.79 features the following amendments:
New Device Support
Many new devices have been added in this revision, please download the full device list to verify your chip is supported: Dataman448Pro2APDeviceList.pdf
Major Changes
General Options/Job Report, file name generation bug fixed
Improved identification of some BGA programming adapter
Menu/Help/Create problem report: processing fixed
Other Changes
Added module: AP1 BGA84-1 ZIF mXT-1
Added module: AP1 LGA86 ZIF STM32WB-1
Added module: AP1 QFN32-1.02 ZIF STM32G-1
Added module: AP1 QFN40-2.02 ZIF TPS53-5
Added module: AP1 QFN48-2.02 ZIF TPS53-2
Added module: AP1 QFN56-1.02 ZIF XDPE-1
Added module: AP1 QFN8-4.02 ZIF M88SDP-1
Added module: AP1 SOIC8 ZIF 150mil AVR-1
Adesto Techn. AT25FFxxx, AT25XExxx family, Chip erase verify improved
Adesto Techn. AT25XE family, Erase operation improved
Atmel/Microchip SPLD devices, adding of bypass capacitor information
Dallas/Maxim DS1820, DS18B20, DS18S20, DS1822, DS1825, DS2401, DS2430, DS2431, DS2432, DS2433, DS2436, DS2438, DS2756, DS2762, DS2781, DS2788, DS2406, DS2502, DS2505, DS2506, DS28E01, DS28E02, DS28E04, DS28E15, DS28EC20, DS2788 Family code check added
Dialog Semicond. AT25FFxxx, AT25XExxx family, Chip erase verify improved
Fudan Microelect. FM25F01B, FM25F005B, FM25Q02B, FM25W02, setting Protected memory modified
GigaDevice GD25Q20E, GD25LQ20B, GD25LQ20E, GD25VQ40C, GD25Q40E, GD25LQ16E, GD25LE16E, setting Protected memory modified
Infineon AURIX family, program/verify procedure and save HEX file procedure modified
Infineon TDA38640, programming improved
Infineon TDA38640 change name to TDA38640 rev. 2/3 [PQFN-5x6]
Infineon TDA38740 change name to TDA38740 rev. 2/3 [PQFN-5x6]
Intel/Numonyx J3 series, blank check procedure improved
Intel/Numonyx PC28F128J3F [Easy BGA64], read of Protection Register modified
Macronix MX25Lxx356, MX25Uxx356, state of Status Register modified during Chip erase
Microchip dsPIC33CK Family, erase before programming improved
Microchip dsPIC33CK64MP102, programming CFG improved
Microchip PIC12F629, PIC12F675, PWRT and BODEN bits description improved
Microchip PIC32MZ EF Family, ABF1SEQ0, ABF2SEQ0, SEQ0, BF1SEQ0, BF2SEQ0 registers removed and SEQ3, BF1SEQ3, BF2SEQ3 registers added
Microsemi ZL3026x, power-up procedure improved
Module AP1 SOIC8 ZIF 150mil AVR-1, automatic yes parameters modified
Motorola/Freescale Semic./NXP MC56F8xxx, DEBUG MODE entrance modified
MPS MP2971/73, programming procedure improved
MPS MP2975/8, conversion of .txt file to .bin file improved
NXP/Freescale Semic. MK10DX256xxx7 [LQFP100], insertion test modified
Nyquest Technology N25Q Series, read operations improved
Nyquest N25Q004A [SOP8-150] (QuadSPI), N25Q008A [SOP8-150] (QuadSPI), N25Q016B [SOP8-150] (QuadSPI), N25Q032A [SOP8-150] (QuadSPI), added support
Renesas R5F524TxAxFF [LQFP80], Boot mode erase modified
Renesas R5F564xxxxxx, programming modified
Renesas R5F564xxxxxx and R5F566xxxxxx, added selectable option 'Skip blank blocks during programming' for programming
Renesas R7FA2E1AxxxFL, programming process modified
Renesas/Intersil RAA228227, RAA228228 programming improved
Renesas/Intersil RAA229126 [QFN48-6x6] (Gen. 3 silicon), ISL69260 [QFN40-5x5] (Gen. 3 silicon), improved support for production silicon
Sandisk SDINBDxx-xxx devices, added option UNI_BOOT_PROC_ENABLE, PPP_FEATURES_ENABLE
Silicon Laborat. EFR32xG13 devices, improving of "Bootloader area" programming procedure
STMicroelectronics STM32G0xx, family option bytes modification
STMicroelectronics STM32H7xx, devices erase procedures modified
STMicroelectronics STM8S001J3M, erase procedures improved
TI (TMS) BQ2022, Family code check added
TI (TMS) BQ26100, ID check modified to family code check
TI (TMS) MSP430G2221, MSP430G2231 power-up procedure improved
TI (TMS) TMS320F28033, programming algorithm improved
Winbond W25N01KVZE [WSON8], device ID check updated according to new datasheet
XMC XM25QH20B, XM25QU20B, setting Protected memory modified
XTX XT25Q08D, setting Protected memory modified
Zbit ZB25VQ40, ZB25LQ40, ZB25VQ16, setting Protected memory modified
Zetta ZD25Q16, setting Protected memory modified
Bug Fixes
Atmel/Microchip ATmega8/L/A [MLF32], Overcurrent error bug fixed
Nuvoton NUC126SG4AE [LQFP64], ID check bug fixed
Nuvoton NUC126Sxxx, APROM size error fixed
Renesas/Intersil ISL69260 [QFN40-5x5] (Gen. 3 silicon), verification bug fixed
Renesas R5F10BGGCxFB [LQFP48], device ID check bug fixed
STMicroelectronics STM32H72x and STM32H73x, Erase Method setting fixed
TI (TMS) BQ26100, Manufacturer / device ID check error bug fixed
Winbond W25Nxxxxxx, Dosilicon DS35xxxB, Macronix MX35UFxG24AD, permanent block lock treatment fixed (default value fixed)
Best regards,
Daniel Smith